Porous pyridine based polyimide-silica nanocomposites with low dielectric constant

KIVILCIM N., SEÇKİN T., KÖYTEPE S.

JOURNAL OF POROUS MATERIALS, cilt.20, sa.4, ss.709-718, 2013 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 20 Sayı: 4
  • Basım Tarihi: 2013
  • Doi Numarası: 10.1007/s10934-012-9645-3
  • Dergi Adı: JOURNAL OF POROUS MATERIALS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.709-718
  • Anahtar Kelimeler: Polyimide, Porous material, Silica, Composites, Dielectric properties, MORPHOLOGY, POLYMER, FILMS
  • İnönü Üniversitesi Adresli: Evet

Özet

Highly porous polymer-silica hybrid materials were prepared based on the organo-soluble polyimides of four various dianhydride and 2,5-diaminopyridine. 3-Aminopropyltriethoxysilane (APS) was used to increase the intrachain chemical bonding and interchain hydrogen bonding between the polyimide and silica moieties, respectively. The chemical interaction would significantly affect the morphologies and properties of the prepared films. The produced polyimide-silica composites were investigated by X-ray diffraction analysis, scanning electron microscope and thermal analysis tecniques. The effect of silica modified with functional group of 3-aminopropyltriethoxy silane on the porous structure and dielectric properties as well as the thermal stability of films were investigated. Capacitances were determined with a HP4294A at a frequency between 1 kHz and 1 MHz. The dielectric constant was significantly reduced with increasing silica modified with APS. The result indicates that the composite materials are potentially useful in low dielectric materials.