Nanowires of Lead-Free Solder Alloy SnCuAg

ATALAY F., AVSAR D., KAYA H., YAGMUR V., ATALAY S., SEÇKİN T.

JOURNAL OF NANOMATERIALS, cilt.2011, 2011 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 2011
  • Basım Tarihi: 2011
  • Doi Numarası: 10.1155/2011/919853
  • Dergi Adı: JOURNAL OF NANOMATERIALS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • İnönü Üniversitesi Adresli: Evet

Özet

Ternary Sn88Ag5Cu7, Sn93Ag4Cu3, Sn58Ag18Cu24, Sn78Ag16Cu6, Sn90Ag4Cu6, Sn87Ag4Cu9 alloy nanowires were produced at various values of deposition potential by dc electrodeposition on highly ordered porous anodic alumina oxide (AAO) templates. During the deposition process some parameters, such as ion content, deposition time, pH, and temperature of the solution, were kept constant. The diameter and length of regular Sn93Ag4Cu3 nanowires electrodeposited at -1V were determined by scanning electron microscopy (SEM) to be approximately 200-250 nm and 7-8 mu m, respectively. Differential scanning calorimetry (DSC) results indicate that the melting onset temperature of Sn93Ag4Cu3 nanowires is about 204 degrees C.