Preparation, Characterization, and Properties of Novel Polyimide-SiO2 Hybrid Composites Based on Bipyridine for Low Dielectric Applications

Koytepe S., KUCUK I., SEÇKİN T., ADIGÜZEL H. İ.

POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING, vol.54, no.12, pp.1251-1262, 2015 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 54 Issue: 12
  • Publication Date: 2015
  • Doi Number: 10.1080/03602559.2015.1010216
  • Journal Name: POLYMER-PLASTICS TECHNOLOGY AND ENGINEERING
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.1251-1262
  • Keywords: Hybrid materials, Low dielectric properties, Polyimide, SiO2, THERMAL-PROPERTIES, SILICA NANOCOMPOSITES
  • Inonu University Affiliated: Yes

Abstract

Novel low dielectric polyimide-SiO2 hybrid materials containing bipyridine were prepared with three-step sol-gel process from poly(amic acid)s. (3-Aminopropyl)triethoxysilane as coupling agent was used to increase the intrachain chemical bonding between the polyimide and SiO2 groups. The thermal, dielectric, and physical properties of the hybrid materials were investigated and correlated with the porous structure. The glass transition temperatures of all the hybrids were found to be higher than polyimides. The effect of SiO2 groups on the porous structure and dielectric properties was investigated. The dielectric constant of the hybrid materials was observed a decrease from 3.30 to 2.15 with increased SiO2 amount.